Method and structures for heat dissipating interposers

ABSTRACT

An interconnect element includes a semiconductor or insulating material layer that has a first thickness and defines a first surface; a thermally conductive layer; a plurality of conductive elements; and a dielectric coating. The thermally conductive layer includes a second thickness of at least 10 microns and defines a second surface of the interconnect element. The plurality of conductive elements extend from the first surface of the interconnect element to the second surface of the interconnect element. The dielectric coating is between at least a portion of each conductive element and the thermally conductive layer.

CROSS-REFERENCES TO RELATED APPLICATIONS

The present application is a continuation of a of U.S. patentapplication Ser. No. 15/626,687, filed on Jun. 19, 2017, which isissuing on Oct. 16, 2018 as U.S. Pat. No. 10,103,094, which is adivisional of U.S. patent application Ser. No. 14/815,282, filed on Jul.31, 2015, which issued on Jun. 20, 2017 as U.S. Pat. No. 9,685,401,which is a divisional of U.S. patent application Ser. No. 13/720,346,filed on Dec. 19, 2012, which issued on Sep. 1, 2015 as U.S. Pat. No.9,123,780, the disclosures all of which are incorporated herein byreference.

BACKGROUND OF THE INVENTION

The technological area of three-dimensional integrated chips (“3D-IC”)and related structures is constantly seeking faster, smaller, and morepowerful structures for use in computers and computer devices. This canresult in chip structures that are increasingly more densely packed andhave ever greater levels of power consumption. Further, chip structurescan include many chips in single packages and/or stacks arrangements ofmultiple

packages. In one example, central processing units or general processingunits can include a control chip included in a package with anadditional package or packages stacked thereon that include memorychips, such as DRAM or the like. Such structures can be used asprocessors for smartphones or the like where a small footprint oroverall size for the assembly is sought.

In these and other assemblies including stacked arrangements ofintegrated circuit chips and the like, and in particular those with highcircuit density or high power consumption, heat dissipation cannegatively impact chip performance. For example, in vertically stackedarrangements, heat tends to dissipate vertically through the structure,meaning that heat from, for example, a control or logic chip can end updissipating into memory chips stacked thereon as the heat is conductedthrough the stack. This phenomenon can cause overall heating of chips ina stack to undesirable levels, either throughout the entire chip or invarious “hot spots” in which a spatial temperature gradient is createdin a chip by heat dissipation from lower chips. In either form, suchheat can cause decreased chip performance or partial or complete chipfailure. Accordingly, heat dissipation is important for such structures.

Heat dissipation has been dealt with in stacked chip arrangements, forexample, by attempts to make vertical heat dissipation as fast aspossible, such as by including large heat spreader structures that caninclude a plurality of fins or the like, on top of a stacked chiparrangement. However, this undesirably increases the size of theassembly. Additionally, active cooling systems have been introduced todissipate heat more quickly and in some instances in lateral directions,rather than vertical. However, for many applications, such as mobiledevices or the like, the increase in overall power consumption requiredby active cooling is undesirable. Accordingly, further advances areneeded.

BRIEF SUMMARY OF THE INVENTION

An aspect of the present disclosure relates to a method for making aninterconnect element. The method includes depositing a thermallyconductive layer on an in-process unit. The in-process unit includes asemiconductor material layer defining a surface and edges surroundingthe surface, a plurality of conductive elements, each conductive elementhaving a first portion extending through the semiconductor materiallayer and a second portion extending from the surface of thesemiconductor material layer. Dielectric coatings extend over at leastthe second portion of each conductive element. The thermally conductivelayer is deposited on the in-process unit at a thickness of at least 10microns so as to overlie a portion of the surface of the semiconductormaterial layer between the second portions of the conductive elementswith the dielectric coatings positioned between the conductive elementsand the thermally conductive layer. The thermally conductive layer canbe further deposited to overlie the surface of the semiconductormaterial in a location adjacent to at least one edge of thesemiconductor material layer.

The method can further include, prior to depositing the thermallyconductive layer, removing a portion of the semiconductor material layerto expose the edge surfaces of the conductive elements and to define thesurface of the semiconductor layer such that portions of the conductiveelements extend away therefrom. The method can also further include,prior to the step of depositing the thermally conductive layer,depositing a barrier layer over at least the surface of thesemiconductor material layer. In such an example, the thermallyconductive layer can be deposited over the barrier layer such that thebarrier layer electrically insulates the semiconductor material layerfrom the thermally conductive layer. The barrier layer can comprise oneof diamond, diamond-like carbon, or diamond moieties.

Depositing the thermally conductive layer can include forming a seedlayer overlying the semiconductor material layer, and can furtherinclude plating the thermally conductive layer over the seed layer. Inany of the examples herein, the thermally conductive layer can bedeposited by a process including one of screen printing, or spincoating. Further depositing the thermally conductive layer can includedepositing copper having a thickness of 10-300 microns. In anotherexample, depositing the thermally conductive layer can includedepositing a highly thermally conductive material of one of graphite andcarbon at a thickness of 10-200 microns.

The method can further include forming a redistribution layer over thethermally conductive layer. The redistribution layer can include tracesconnected with at least some of the conductive elements.

In an example of the method, each conductive element further has an edgesurface and an end surface, the end surface being spaced apart from thesurface of the semiconductor material layer. In such an example thethermally conductive layer can be further deposited to extend overrespective edge surfaces of the conductive elements. The thermallyconductive layer can be deposited over the edge surface and end surfaceof the conductive element, and the method can further include removing aportion of the thermally conductive layer that overlies the end surfaceto expose the end surface at a surface of the thermally conductivelayer.

The method can further include depositing a patternable material layerover the surface of the semiconductor material layer and patterning thepatternable material layer to form a plurality of spacers extending inat least one lateral direction along the surface of the semiconductormaterial layer prior to depositing the thermally conductive layer. Thethermally conductive layer can then be deposited in a plurality ofsections with respective ones of the spacers therebetween. In anexample, the patternable material layer can be of a resist material. Thepatternable material layer can be deposited over the surface of thesemiconductor material layer to extend to at least one edge of thesemiconductor material layer. Further, the spacers and the sections ofthe thermally conductive layer can be formed to extend to at least oneedge of the semiconductor material layer.

In another example, the method can further include removing portions ofthe thermally conductive layer to form a plurality of gaps extending inat least one lateral direction over the surface of the semiconductormaterial layer. The gaps can be between respective sections of thethermally conductive layer. The portions of the thermally conductivelayer can be removed by etching. In such an example, the method canfurther include depositing a compliant material within at portions of atleast one of the gaps. The compliant material can be a polymericmaterial having thermally conductive particles suspended therein.Additionally or alternatively, the sections of the thermally conductivelayer can define substantially co-planar outside surfaces, and thecompliant material can be deposited so as to be recessed below theoutside surfaces. The compliant material can be deposited so as to bespaced apart from the surface of the semiconductor material layer.

The method can further include assembling a conductive frame elementwith the interconnect element in contact with the thermally conductivelayer and further extending over at least one edge of the semiconductormaterial layer. The conductive frame element can be assembled around aperimeter of the interconnect element.

In an example, the thermally conductive layer can be deposited such thatan aggregate of the conductive elements and the thermally conductivelayer covers at least 90% of a surface area defined by the edges of thesemiconductor layer. In another example, the thermally conductive layercan be deposited such that an aggregate of the conductive elements andthe thermally conductive layer occupies at least 90% of an area definedby a theoretical cross-section of the interconnect element outside ofthe semiconductor layer. Such a cross-section can be determined by aplane normal to the surface of the semiconductor layer.

Another aspect of the present disclosure relates to a method for makingan interconnect element. The method includes forming a conductiveelement within a semiconductor material layer. The conductive element isformed to extend into the semiconductor material layer from a firstsurface and having at least one end surface and one edge surfaceextending from the first surface of the semiconductor material layer tothe end surface of the conductive element. A portion of material is thenremoved from a second surface of the semiconductor substrate to revealthe end surface of the conductive element and at least a portion of theedge surface of the conductive element. The method also includesdepositing a thermally conductive layer on the in-process unit over thesurface of the semiconductor layer at a thickness of at least 10 micronsso as to overlie a portion of the surface of the semiconductor materiallayer between the second portions of the conductive elements with thedielectric coatings positioned between the conductive elements and thethermally conductive layer.

The step of depositing the thermally conductive layer can includedepositing copper, and the thermally conductive layer can be depositedhaving a thickness of 10-300 microns. In another example, depositing thethermally conductive layer can include depositing a highly thermallyconductive material of one of graphite and carbon, and the thermallyconductive layer can be deposited at a thickness of 10-200 microns.

The method can further include forming a redistribution layer over thethermally conductive layer. Such a redistribution layer can includetraces connected with at least some of the conductive elements.

The step of depositing the thermally conductive layer can includepatterning the thermally conductive layer to form gaps between sectionsthereof. The sections of the thermally conductive layer can be fins thatextend from and along the surface of the semiconductor material layer.Depositing the thermally conductive layer can further include filing thegaps with a polymer. In another example, the step of depositing thethermally conductive layer can include depositing sections of thethermally conductive layer between portions of a patterned resist layersuch that the portions of the patterned resist layer fill gaps betweenthe section of the thermally conductive layer.

Another aspect of the present disclosure relates to an interconnectelement including a semiconductor or insulating material layer having afirst thickness and defining a first surface. The interconnect elementalso includes a thermally conductive layer having a second thickness ofat least 10 microns and defining a second surface of the interconnectelement. A plurality of conductive elements extend from the firstsurface of the interconnect element to the second surface of theinterconnect element. Dielectric coatings are positioned between atleast a portion of each conductive element and the thermally conductivelayer.

The thermally conductive layer can be electrically connected with atleast one of the conductive elements such that the conductive element isconfigured as a ground element. In another example, the conductiveelements are configured as through-substrate electrodes that defineconductive connections between surfaces thereof.

The thermally conductive layer can extend from proximate to theconductive elements to at least one edge of the semiconductor orinsulating material layer.

The interconnect element can further include a barrier layer between atleast the surface of the semiconductor or insulating material layer andthe thermally conductive layer. Such a barrier layer can electricallyinsulate the semiconductor or insulating material layer from thethermally conductive layer. The barrier layer can comprises one ofdiamond, diamond-like carbon, or diamond moieties.

The thermally conductive layer can include copper, and the thermallyconductive layer can have a thickness of between 10 and 300 microns. Inanother example the thermally conductive layer can include a highlythermally conductive material of one of graphite and carbon, and thethermally conductive layer can have a thickness of between 10 and 200microns.

The interconnect element can further include a redistribution layeroverlying the thermally conductive layer. The redistribution layer caninclude traces connected with at least some of the conductive elements.

The thermally conductive layer can include a plurality of sectionsextending in at least one lateral direction along the surface of thesemiconductor layer, and the interconnect element can further include aplurality of spacers between adjacent ones of the sections of thethermally conductive layer. The spacers and the sections of thethermally conductive layer can extend to at least one edge of thesemiconductor material layer. In another example, the spacers can extendalong a path having directional components in at least two lateraldirections. In either example, the spacers can be of a compliant, heatconductive material. For example, the spacers can be of a polymericmaterial having thermally conductive particles suspended therein. Thesections of the thermally conductive layer can define substantiallyco-planar outside surfaces, and the spacers can be recessed below theoutside surfaces. In another example, the spacers can be spaced apartfrom the surface of the semiconductor or insulating material layer.

The interconnect element can further include a heat conductive frameelement in contact with the thermally conductive layer and furtherextending over at least one edge of the semiconductor or insulatingmaterial layer. The conductive frame element can be positioned around aperimeter of the interconnect element.

The interconnect element can further include at least one of an activeor passive device within the semiconductor layer that is electricallyconnected with at least one of the conductive elements.

Another aspect of the present disclosure relates to a microelectronicassembly. The assembly includes an interconnect element according any ofthe above examples, and a microelectronic element including contactelements at a surface thereof. The microelectronic element is attachedto the interconnect element and the contact elements are electricallyconnected with the conductive elements.

In such an assembly, the interconnect element can be attached to themicroelectronic package and the contact elements can be electricallyconnected with the conductive elements by joints between the contactelements and the end surfaces of the conductive elements. Theinterconnect element can include contact elements at a surface thereofthat are electrically connected with the conductive elements, and theinterconnect element can be attached with the microelectronic packagewith the contact elements electrically connected with the conductiveelements by joints between the contact elements and the contact pads.

Another aspect of the present disclosure relates to a method offabricating a microelectronic package including assembling aninterconnect element as described in any of the examples above with amicroelectronic package having contact elements at a surface thereofsuch that the interconnect element is attached with the microelectronicpackage and the contact elements are electronically interconnected withthe conductive elements. The step of assembling can include joining thecontact elements with end surfaces of the conductive elements. Inanother example, the step of assembling can include joining the contactelements with ones of the contact pads of the interconnect element thatare at a surface of the interconnect element. The conductive pads can beelectrically connected with the conductive elements by tracesinterconnect element.

BRIEF DESCRIPTION OF THE DRAWINGS

Various embodiments of the present invention will be now described withreference to the appended drawings. It is appreciated that thesedrawings depict only some embodiments of the invention and are thereforenot to be considered limiting of its scope.

FIG. 1 is a schematic view of an interconnect element according to anaspect of the disclosure;

FIG. 2 is another example of an interconnect element according toanother aspect of the disclosure;

FIG. 3A is another example of an interconnect element according toanother aspect of the disclosure;

FIG. 3B is a top schematic view of an interconnect element of a similarconstruction to that shown in FIG. 3A;

FIG. 3C is a top schematic view an interconnect element similarconstruction to that shown in FIG. 3A of an alternative configuration;

FIG. 4 is another example of an interconnect element according toanother aspect of the disclosure;

FIG. 5 is another example of an interconnect element according toanother aspect of the disclosure;

FIG. 6 is an interconnection element that is a variation of theinterconnection element of FIGS. 4 and 5;

FIG. 7 shows the interconnection element of FIG. 6 with an additionalredistribution layer thereon;

FIG. 8 shows the interconnection element of FIG. 7 with a thermallyconductive frame element assembled therewith;

FIG. 9 shows an assembly of interconnection elements havingmicroelectronic elements connected therewith and arranged in a stackedconfiguration;

FIG. 10 shows the a further assembly of sub-assemblies show in FIG. 9with additional elements;

FIGS. 11-17 show an interconnection element during various sequentialstages of formation thereof in a method according to another aspect ofthe disclosure;

FIGS. 18-22 show an interconnection element during various sequentialstages of formation thereof in an alternative method according toanother aspect of the disclosure;

FIGS. 23 and 24 show the interconnection element of FIGS. 18-22 duringadditional optional method steps; and

FIG. 25 is a chart showing a maximum temperature reached in exampleinterposers of varying compositions and thicknesses.

DETAILED DESCRIPTION

Turning to the figures, wherein like reference numerals are used toindicate similar features, there is shown in FIG. 1, an interconnectionelement in accordance with an aspect of the present disclosure. Theinterconnection element shown in FIG. 1 is in the exemplary form of aninterposer 10, but other interconnection elements can be constructedaccording to the description herein. Interposer 10 includes a pluralityof connection elements extending at least partially therethrough. Theconnection elements shown in FIG. 1 are in the exemplary form ofthrough-substrate vias 20 configured to provide an electrical connectionbetween opposed end surfaces 22 and 24 thereof. Other connectionelements can be incorporated or otherwise used in interconnectionelements according to aspects of the present disclosure includinginterposers or other examples thereof.

Interposer 10 includes a semiconductor material layer 12 definingopposing surfaces 14 and 16 that can be generally parallel and extend inlateral directions 11 and 13, where lateral direction 13 indicates adirection into or out of the page in FIG. 1. In other examples orembodiments of interposer 10, an insulating, or dielectric, layer can beused in place of semiconductor material layer 12. Such examples andembodiments can be similar in all other respects to those including asemiconductor material layer 12, as described herein. A thickness of thesemiconductor material layer 12 is defined between surfaces 14 and 16.Examples of materials that can comprise the semiconductor material layerinclude silicon, diamond, germanium, silicon carbide, certain ceramicsor the like. The vias 20 extend at least partially through thesemiconductor layer 12 such that the respective end surfaces 22 and 24are at respective surfaces 14 and 16 of the semiconductor material. Asused in this disclosure with reference to a substrate, a statement thatan electrically conductive element is “at” a surface of a substrateindicates that, when the substrate is not assembled with any otherelement, the electrically conductive element is available for contactwith a theoretical point moving in a direction perpendicular to thesurface of the substrate toward the surface of the substrate fromoutside the substrate. Thus, a terminal or other conductive elementwhich is at a surface of a substrate may project from such surface; maybe flush with such surface; or may be recessed relative to such surfacein a hole or depression in the substrate. The vias 20 are furtherstructured to extend outwardly of semiconductor layer with end surface22 thereof spaced above surface 14 of semiconductor material layer 12.The relative term “above” is used herein with respect to the exampleorientation of interposer 10 shown in FIG. 1 and is not limiting withrespect to actual positions of the elements discussed herein.

Semiconductor material layer 12 is structured such that surface 14 ispositioned between end surfaces 22 and 24 of via 20. A thermallyconductive material layer 38 overlies surface 14 and extends alongportions of the vias 20, including along edge surfaces 26 thereof, thatextend above the semiconductor material layer 12. Thermally conductivelayer is generally structured to surround such portions of vias 20 andto fill spaces therebetween. Thermally conductive layer 38 may befurther structured to extend along surface 14 in lateral directions11,13 toward the edges 18 thereof. In one example, semiconductormaterial layer 12 can include four edges and thermally conductive layercan be configured to extend to a position adjacent at least one of theedges 18 of semiconductor material layer 12. In another example,thermally conductive layer can extend to positions adjacent or overlyingedges 18 on opposing sides of semiconductor material layer 12. In yetanother example, thermally conductive layer can extend to positionsadjacent all edges 18 of semiconductor material layer 12. In suchexamples, adjacent an edge 18 can mean that thermally conductive layeris flush with such an edge 18 along a portion thereof or spaced inwardlyin lateral directions 11,13 from edge 18 along surface 14 such that, forexample, thermally conductive layer is positioned between the edge 18and a closest one of vias 20 to that edge 18. In another example,adjacent an edge 18 can mean that thermally conductive layer ispositioned within 100 microns of edge 18.

Thermally conductive layer 38 can define a surface 40 that is spacedapart from and faces away from surface 14 of semiconductor materiallayer 12. Surface 40 can be adjacent end surfaces 22 of vias 20 suchthat surface 40 can be flush with end surfaces 22 or such that endsurfaces 22 can project above or be recessed below surface 40. Such arelationship between end surface 22 and surface 40 can be dictated orotherwise influenced by different types of conductive elements that canbe joined with end surfaces 22 such as traces, contact pads, vias or thelike.

Thermally conductive layer 38 can comprise or consist essentially of athermally conductive material, such as metals including copper,aluminum, nickel, gold, or various alloys of these and other metals. Inother examples, thermally conductive layer 38 can comprise or consistessentially of a material including carbon, such as graphite or thelike. One example of such a material is highly ordered pyrolyticgraphite (“HOPG”). By including thermally conductive layer around andbetween vias 20 and extending in lateral directions toward the edges ofsemiconductor material layer 12, thermally conductive layer can conductheat in lateral directions throughout the interposer 10 structure. Thiscan prevent or reduce the appearance of “hot spots” within theinterposer 10 itself or in an assembly (such as assembly 60 in FIG. 9 orassembly 62 in FIG. 10) that includes interposer 10 or interposers 10that can arise from the vertical dissipation of heat that occurs withinsuch interposers related assemblies.

The lateral heat dissipation provided by thermally conductive layer maynot eliminate vertical heat dissipation through interposer 10 orassemblies 60 or 62, but by adding a lateral component to such heatdissipation, the amount of heat passing vertically through any one areacan be decreased as at least some of the heat travels laterally to anextent while also traveling vertically. Thus, the area through whichvertical heat dissipation occurs can be increased, while the maximumamount of heat dissipated through various points within such an area isreduced, accordingly reducing maximum temperatures to which structureswithin such a dissipation area are raised by such a heat flow.

As shown in FIG. 25, the thickness and composition of thermallyconductive layer 38 can relate to the amount of lateral heat dissipationachieved by thermally conductive layer 38. Of the various materials thatcan be used for thermally conductive layer 38, some may be morethermally conductive than others, particularly among metals.Accordingly, less thermally conductive materials may require that athermally conductive layer 38 of such materials have a greater thicknessthat those of other materials. In particular, many microelectronicelements, such as semiconductor chips and the like, have an acceptedtemperature threshold, above which the performance of such elementsdecreases or above which actual damage to the components can occur.Accordingly, in some examples, it may be beneficial to provide thermallyconductive layers in interposers 10 to provide adequate lateral heatdissipation to maintain maximum point temperatures within assembliesthat include such interposers 10 below such thresholds. In theparticular examples shown in FIG. 25, 2 cm by 2 cm chips includinginterposers with thermally conductive layers of various materials wereshown to adequately maintain temperatures within the chips below anexemplary thermal budget of 105° C. at 200 μm or thicker for a thermallyconductive layer of copper and 50 μm or thicker for HOPG. As shown, HOPGcan be effective at laterally dissipating heat, particularly whenordered laterally, which allows the HOPG layer to be more thermallyconductive in the lateral directions than it is in vertical directions.

Other thicknesses for thermally conductive layers of copper and HOPG canbe used in larger or smaller chips or in chips with varying forms ofmicroelectronic elements and/or active and passive devices or in chipsof varying sizes. In various examples, an interposer 10 used in variousapplications within a range of acceptable sizes can have a thermallyconductive layer with a thickness of between 10 and 200 microns. Otherapplications can have a thermally conductive layer of 200 microns orgreater. As further shown in FIG. 25, a semiconductor material such assilicon is less thermally conductive than the materials described hereinfor use as a thermally conductive layer. Accordingly, such asemiconductor material may have to be far thicker than would bepractical to even reach an upper threshold of a thermal budget.

In applications where thermally conductive layer 38 is of a materialthat is also electrically conductive, such as in variations of thermallyconductive layer 38 that include metal, a dielectric coating can bepositioned between vias 20 and thermally conductive layer 38. As shownin FIG. 1, dielectric coatings 28 can extend along edge surfaces 26 ofvias 20 so as to surround vias 20 and electrically insulate them fromthermally conductive layer 38. Dielectric coatings 28 can also bepositioned between vias 20 and semiconductor material layer 12 toelectrically insulate vias from the semiconductor material layer aswell. Dielectric coatings 28 can be configured to be thin enough toelectrically insulate vias 20 from thermally conductive layer 38 withoutnegatively impacting any thermal conduction between vias 20 andthermally conductive layer 38.

A barrier or buffer layer 36 can be positioned between Semiconductormaterial layer 12 and thermally conductive layer 38 to facilitateattachment of thermally conductive layer 38 to Semiconductor materiallayer 12 and/or to prevent contamination of semiconductor material layer12 with particles from thermally conductive layer 38. Acceptablematerials for barrier layer 36 can include SiC, SiN, diamond-like carbon(“DLC”), diamond, or other diamond moieties. Additionally, thermallyconductive layer 38 may be coated with diamond or DLC or other diamondmoieties. A diamond or DLC barrier layer 36 or coating can provides highlevels of thermal conductivity while being an acceptable electricalinsulator between semiconductor material layer 12 and thermallyconductive layer 38. This assists in conducting heat from thesemiconductor material layer 12 to the thermally conductive layer 38 orfrom the thermally conductive layer 38 to the environment (in instancesof a coating). Further a coating of diamond or DLC applied over oraround thermally conductive layer 38 can protect the thermallyconductive layer from the surrounding environment.

As further shown in FIG. 1, interposer can include a redistributionlayer 30 over surface 16 of semiconductor material layer 12. Theredistribution layer can include, for example, traces 32 or additionalvias connected to end surfaces 24 or vias 20 within a dielectric and caninclude contacts 34 exposed on redistribution layer 30 that can be, forexample in a different spatial configuration than the end surfaces 24with which they are connected. As further shown in FIG. 2, anotherredistribution layer 42 can be included over surface 40 of thermallyconductive layer 38 that can include traces 44 and contacts 46 in asimilar arrangement to that of redistribution layer 30. In someexamples, spacers 54 can be of a thermally conductive compliantmaterial, such as a dielectric with thermally conductive particlestherein.

Another example of an interposer 110 according to an aspect of thepresent disclosure is shown in FIGS. 3A and 3B. In this example,thermally conductive layer 138 includes a plurality of segments 150separated by gaps 152. Such gaps 152 can extend entirely throughthermally conductive layer 138 such that segments 150 are completelyseparated or can extend only partway through thermally conductive layer138 such that segments 150 are connected by portions of thermallyconductive layer 138 adjacent surface 114. In the example of FIG. 3A,gaps 152 are filled with a compliant material that forms a plurality ofrespective spacers 154 between segments 150. The compliant nature ofspacers 154 can be such that variations in thermal expansion betweensemiconductor material layer 12 and thermally conductive layer 38 can beabsorbed at least partially by spacers 154. In the plan view ofinterposer 110 shown in FIG. 3B it can be seen that segments 150 can bestructured to extend continuously in at least one lateral directionbetween edges 118 of interposer or between positions adjacent edges 118of interposer 110. Such an arrangement can prevent any insulatingproperties of spacers 154 from preventing thermal conduction in at leastone lateral direction. As illustrated in FIG. 3C, thermally conductivelayer 238 can include gaps 252 that are not straight lines, but ratherhave components in multiple lateral directions. In the exampleinterposer 210 shown, gaps 252 can have a zig-zag or sawtooth shape toprovide for at least partial compliance in multiple lateral directions,while still having thermally conductive segments 250 that are continuousin a lateral direction. Also, while FIGS. 3B and 3C show variations withsections 150 and 250 extending in one direction, similar sections couldextend in two directions, such as in a grid-like configuration. Also,the thermally conductive material sections could be laid out in one ormore rings that are concentric with the conductive elements (such as 120and 220). The thermally conductive sections, whether laid out asstraight or zig-zag fins, as a grid or as concentric rings could becontinuous or could have slits to allow for the different CTE of thethermally conductive sections and the semiconductor material layer.

FIGS. 4-7 show further variations of interposers having segmentedthermally conductive layers. In one example, interposer 310 can includegaps 352 separating segments 350 of thermally conductive layer 338. Suchgaps 352 can include spacers 354 that extend from adjacent surface 314of semiconductor material 312 to a location between surface 314 and theoutside surface 340 of thermally conductive layer 338. In anotherexample shown in FIG. 5, spacers 354 can be flush with surface 314 andcan extend to a position spaced apart from surface 314 such. In afurther example interposer 410 shown in FIG. 6, gaps 552 can be leftunfilled. As shown in FIG. 7 an example of an interposer 510 having asegmented thermally conductive layer 538 can include a redistributionlayer 542 over surface 540. In a similar manner, the interposers shownin FIGS. 3-5 can also include such a redistribution layer.

FIG. 8 shows a variation of an interposer 610 that includes a thermallyconductive frame 656 that surrounds outside surfaces of bothsemiconductor material and thermally conductive layer 638. Thermallyconductive frame can be of a similar or different material fromthermally conductive layer 638, including any of the materials describedabove, and can be in contact with thermally conductive layer 638.Thermally conductive frame 656 can provide a heat sink for thermallyconductive layer 638 to encourage further lateral heat dissipationtherethrough and can provide for additional surface area of an exposedthermally conductive material to allow for additional exposure toambient air for heat removal therefrom.

FIGS. 9 and 10 show examples of different types of microelectronicassemblies that can incorporate interposers 10 of any of the typesdescribed in the preceding examples. For clarity, the interposers 10shown in FIGS. 9 and 10 are similar to those described above withrespect to FIG. 1. The assembly 60 shown in FIG. 9 includes a stack ofsubassemblies 61 that can include a microelectronic element 64 carriedon an interposer such that contacts (not shown) on the microelectronicelement are connected with contacts 64 of the interposer 10. Thesubassemblies can then be stacked on top of one another and electricallyconnected together, either through designated ones of vias 20 that areconnected together through routing circuitry of the redistributionlayers 30 and 42, for example. Such an assembly can, in one example, bea stack of DRAM chips.

FIG. 10 shows a further assembly 62 that can include a stacked assembly60 or multiple stacked assemblies 60, as shown, such as that describedwith respect to FIG. 9, assembled on a relatively larger interposer 66that is shown as being similar to the interposer 610 described abovewith respect to FIG. 8, but can also be similar to any of thosedescribed above with respect to FIGS. 1-7 or can be another type ofinterposer. Another microelectronic element 64 can be connected withinterposer 66 and can be, in one example, a central processing unit(“CPU”) and/or a graphics processing unit (“GPU”) such that assembly 62can be configured as a “system on a chip” type of processor that can beused, in some examples, in portable electronic devices and the like.

FIGS. 11-24 show an in-process unit 10′ during various steps of a methodthat can be used to make an interposer 10 according to the examplesdescribed above. FIG. 11 shows in-process unit 10′ as a bulksemiconductor layer 12′ having blind vias 20 with end surfaces 24 atsurface 16 of the bulk semiconductor layer 12′ and surface 14′ of bulksemiconductor layer 12′ spaced above end surfaces 22 of vias 20,although in other variations vias 20 can be formed as through vias withboth ends 22 and 24 at respective surfaces 14 and 16 of bulksemiconductor layer 12′. Bulk semiconductor layer 12′ can include aredistribution layer 30 over surface 16, as discussed above with respectFIG. 1.

As shown in FIG. 12, bulk semiconductor layer 12′ can then be reduced inthickness to form the semiconductor material layer 12, as describedabove with respect to FIG. 1 this reduction can be accomplished byremoving material from bulk semiconductor layer 12′ between vias 20,which can be done by chemical or mechanical processes such as chemicaletching, laser etching or the like. In-process unit 10′ (FIG. 11) can betemporarily affixed with a support substrate 70 to provide additionalstrength for the temporarily-thinned in-process unit 10′. (FIG. 12.)Barrier layer 36 can then be deposited over surface 14, as formed in thereduction step of FIG. 12. As shown in FIG. 13, barrier layer 36 canfurther be deposited over vias 20, including over dielectric coatings 28that can overlie edge surfaces 26 and end surfaces 22 of vias 20.Barrier layer 36 can be formed by electroplating, electroless plating,chemical vapor deposition (“CVD”) or the like. A seed layer 72 can thenbe added over barrier layer 36 that can be of the same material that isintended to be used for thermally conductive layer, such as copper orthe like. Seed layer 72 can be added to in-process unit 12′ byelectroplating, electroless plating, CVD or the like. Further, portionsof a resist layer 74 can be deposited over barrier layer 36 and seedlayer 72 to overlie end surfaces 22 of vias 20.

Thermally conductive layer 38 can then be deposited over seed layer 72such as by plating, electroless plating, spin coating, or the like.Thermally conductive layer can be any of the types of materialsdiscussed above with respect to FIG. 1. Thermally conductive layer 38can be deposited to a thickness such that an outside surface 40 is evenwith end surfaces 22 or with outside surface 40 spaced above endsurfaces 22. In such a configuration, resist layer portions 74 canprevent build up of thermally conductive material over end surfaces 22.In either such configuration, thermally conductive layer 38 can then bechemically or mechanically polished such that surface 40 can be evenwith or substantially even with end surfaces 22 of vias 20 and/or toremove resist layer portions 74.

In examples where a redistribution layer 42 is to be formed over surface40, a dielectric layer portion 80 can be deposited over surface 40,followed by a mask layer 76 that can be of, for example, a resistmaterial, as shown in FIGS. 16 and 17. The mask layer 76 can bepatterned to remove portions thereof overlying vias 20 so that anyportions of thermally conductive layer 38, barrier layer 36, or portionsof dielectric coating 28 overlying end surfaces 22 can be removed byetching or the like. This can allow for traces 44 of redistributionlayer 42 to be connected therewith, as described above with respect toFIG. 2.

Various method steps can be performed on in-process unit 12′ to make aninterposer with a segmented thermally conductive layer such as thatshown in FIGS. 3-8. In one method, as shown in FIGS. 18-22, apatternable layer 78 can be deposited over seed layer 72, as shown inFIG. 18. The patternable layer 78 can be deposited to a thicknessadequate to fully cover vias 20 or other suitable heights. Thepatternable layer can be of a resist material or the like and canfurther be a compliant dielectric material that is also suitable as aresist layer. The patternable layer 78 can then be patterned, such as bymechanical etching including laser etching or the like to make spacers54, as shown in FIG. 20. The spacers 54 can be of any configurationdescribed above with respect to FIGS. 3-8. Subsequently, thermallyconductive material can be deposited on in-process unit 10′ by any ofthe processes described above. Thermally conductive material can bedeposited over Semiconductor material layer 12 between the spacers 54formed previously such that thermally conductive material is in segments50, as described above and as shown in FIG. 21. Portions of the spacers54 that extend outside of thermally conductive material layer 38 orabove segments 50 thereof can then be removed such that spacers 54 aregenerally flush with surface 40, as shown in FIG. 22.

In another sequence of steps, thermally conductive layer 38 can bedeposited over Semiconductor material layer 12, as described above withrespect to FIG. 15. Before or after additional processing steps alsodescribed above, thermally conductive layer can be segmented by chemicalor mechanical processes, such as etching, laser etching, sawing, or thelike, to form gaps 52 in any of the above-described patterns, shapes, orforms, as shown in FIG. 23. Gaps 52 can be left open, as shown in FIG. 7for interposer 10 is assembled with other components, as describedabove, or otherwise finished, such as by formation of a redistributionlayer 42. Alternatively, gaps 52 can be filled with a dielectricmaterial, or a compliant dielectric material, as described above to makespacers 54 therein, as shown in FIG. 24. The dielectric material can bedeposited within gaps 52 by molding a curable liquid material layer orby depositing a curable liquid material over thermally conductive layer38 and then by wiping or otherwise forcing such a liquid material intogaps 52. Such processes can be carried out to achieve any of the spacer54 configurations shown in FIGS. 3-5.

The interposer 10 resulting from any of the above particular formationmethods can then be assembled with other components, such asmicroelectronic elements or the like, or together with other interposersor the like, to make assemblies such as assembly 60 shown in FIG. 9 orassembly 62 shown in FIG. 10.

Although the description herein has been made with reference toparticular embodiments, it is to be understood that these embodimentsare merely illustrative of the principles and applications of thepresent disclosure. It is therefore to be understood that numerousmodifications may be made to the illustrative embodiments and that otherarrangements may be devised without departing from the spirit and scopeof the present disclosure as defined by the appended claims.

The invention claimed is:
 1. An assembly comprising: an interconnectcomponent comprising: a thermally conductive carbon layer; an insulatinglayer overlying the thermally conductive carbon layer; a plurality ofconductive vias extending through the conductive layer and theinsulating layer, such that a first end of the plurality of conductivevias is disposed at an outermost surface of the insulating layer and anopposed second end of the plurality of conductive vias is disposed at anoutermost surface of the thermally conductive carbon layer; and adielectric layer extending along a length of the plurality of conductivevias, such that the thermally conductive carbon layer and the insulatinglayer are spaced away from the plurality of conductive vias by thedielectric layer.
 2. The interconnect component according to claim 1,wherein portions of the thermally conductive carbon layer includethermally conductive carbon segments separated by gaps within thethermally conductive carbon layer.
 3. The interconnect component ofclaim 2, wherein the gaps extend entirely through the thermallyconductive carbon layers such that the thermally conductive carbonsegments are completely separated from one another.
 4. The interconnectcomponent of claim 2, wherein the gaps extend partially through thethermally conductive layer, such that at least portions of the thermallyconductive carbon segments are connected together.
 5. The interconnectcomponent of claim 2, wherein the gaps are filled with a compliantmaterial forming a plurality of respective spacers between the thermallyconductive carbon segments so as to absorb variations in thermalexpansion between the insulating layer and the thermally conductivelayer.
 6. The interconnect component of claim 2, wherein the pluralityof spacers extend in a planar direction.
 7. The interconnect componentof claim 2, wherein the plurality of spacers extend in multiple lateraldirections.
 8. The interconnect component of claim 2, wherein theinsulating layer is a dielectric layer.
 9. The interconnect componentaccording to claim 1, further comprising a redistribution layeroverlying the interconnect component and electrically connected with theplurality of conductive vias.